Refurbished Gasonics Aura 3010

Manufacturer:Gasonics

Refurbished by:Allwin21 Corp

Aura 3010.The Aura 3010(Aura3000) is a single-wafer downstream photoresist asher, delivers high ash rates with low damage, a large process window, and a choice of process temperatures during the ashing process. The system has a user friendly menu-driven user interface, and is suitable for automation via SMIF (Standard Mechanical Interface) or AGV (Automated Guided Vehicle).3 to 8 inch wafer capability .

• No RF damage (Ł0.1 volt CV shift)
• High throughput
• Front and backside etching
• Excellent etch rates and uniformities
• 75mm – 200mm wafer capability
• 3 gas MFC
• Variable platen temperature
• Alumina (ceramic) plasma tube
• Well-characterized process
• Multiple step process capability
• High capital productivity.
• Chamber wall heated and temperature controlled to make better repeatability.

GaSonic Aura 3010 Applications:

• Photoresist Stripping

  High dose implant (As+, B+, P+)
  Post-polysilicon etch
  Post-metal etch
  Post-oxide etch
  Rework
  Controlled Resist Removal

• Post-develop descum (pre-etch)
  Dry/wet process capability
  Resist planarization
  Uniformity capability (5% 1s)

We can also provide advanced Equip Robot transfer wafer technology , AW Control Software and Superior Temperature Control Technology to upgrade the refurbished Gasonics Aura 3010 which provides the following significant advantages.

• Use Equip robot wafer transfer instead of the index of the original, which will decrease the down time and low the wafer damage, particles greatly
• Pentium PC computer equipped either DOS Windows
• Interface control board with parallel connectors between PC computer and the system .
• New 16 bits A/D measurement system to replace original 12 bits A/D system to improve the accuracy of the measurements of gas flow, vacuum pressure, EOP, temperature of the wafer, etc. to improve the repeatability of the Asher process.
• New 14 bits D/A system to replace original old 8 bits D/A to improve the accuracy of the set point of the vacuum pressure, gas flow, etc.
• Add new RTP system to get more accuracy temperature control to improve the repeatability of the process. The new RTP system includes(1)New lamp control system with new special solid-state relay control system. It is similar to the oven control system of the RTP machine;(2)New zero crossing detects system. It is similar to the zero crossing detect of the RTP machine.(3)K-type thermocouple system with vacuum feed-through and amplifier to measure the temperature of the wafer. The thermocouple is touching the backside of the wafer directly. The feed-through is put on the front door, which is good when the wafer heated at 450 degree C.(4)Replace the center lamp of the system to be the same high power as the side one to speed up the heat speed and improve the uniformity of the asher and descum process.
• User-friendly recipe editor with gas flow set point, vacuum pressure set point, RF on or off set up, temperature setup etc.
• New GUI interface with curves display of the temperature, vacuum pressure, gas flow, RF status, EOP signal etc. during the process.
• Saved all process data on the local hard disk and send data to the server if it is needed (option).
  Saved all operation function, date, time and error message on the lot file.
• Wafer ID reading function to read wafer ID and use the wafer ID for the data ID to save the process data. Data saved with 4 layers: (1) directory (say year 2003,2004), (2) lot ID, (3) Date Time or step ID, (4) wafer ID. So it is easy to trace the data.
• Bar code function for the lot ID, recipe ID selection option.
• Manual and auto process running
• System diagnostics for the quick diagnostic of the system
• Easier I/O set and checks function for the Maintenance
• RTP function with temperature control ą1~2°C accuracy from 50 to 500°C with K-type thermocouple.
• Higher through put.
• Advanced accurate temperature control to make much better repeatability .
• Better uniformity duo to the center lamp has the same power as the side lamp .
• All process data saved and easier for failure analyzer and process debug .
• “Exposed” I/O, A/D, D/A is easier for troubleshooting and maintenance.