Plasma Asher In semiconductor manufacturing plasma asher/stripper is the process of removing the photoresist from an etched wafer. Using a plasma source, a monatomic reactive species is generated. Oxygen or fluorine are the most common reactive species. The reactive species combines with the photoresist to form ashing which is removed with a vacuum pump. Typically, monatomic (single atom) oxygen plasma is created by exposing oxygen gas (O2) to ionizing radiation. At the same time, many free radicals are formed which could damage the wafer. Newer, smaller circuitry is increasingly susceptible to these particles. Originally, plasma was generated in the process chamber, but as the need to get rid of free radicals has increased, many machines now use a downstream plasma configuration, where plasma is formed remotely and channeled to the wafer. This allows electrically charged particles time to recombine before they reach the wafer surface, and prevents damage to the wafer surface. Monatomic oxygen is electrically neutral and although it does recombine during the channeling, it does so at a slower rate than the positively or negatively charged free radicals, which attract one another. Effectively, this means that when all of the free radicals have recombined, there is still a portion of the active species available for process. Because a large portion of the active specie is lost to recombination, process times may take longer. To some extent, these longer process times can be mitigated by increasing the temperature of the reaction area. We can provide the following refurbished plasma asher/descum equipment.
We provide our own proprietary AW Control Software and Superior Temperature Control Technology to upgrade the refurbished equipment which provides the following significant advantages.
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| AccuThermo AW 410 | |
| AccuThermo AW 610 | |
| AccuThermo AW 810 | |
| AG Heatpulse 210 | |
| AG Heatpulse 410 | |
| AG Heatpulse 610 | |
| Matrix 105 | |
| Matrix 10 | |
| Gasonics Aura 1000 | |
| Gasonics Aura 3010 | |
| Gasonics Aura 2000LL | |
| Branson IPC 3000 | |
| Branson IPC L3200 | |
| Matrix 303 | |
| Gasonics AE 2001 | |
| AutoEtch Lam 490 | |
| Lam Rainbow 4520 Oxide Etch | |
| Lam 4428 for Plasma Etch | |
| PCM Software | |
| HP 4062UX | |
| HP 4145B | |
| EG 1034 | |
| EG 2001 | |
| EG HORIZON 4085X | |
| Temptronic TP03500 | |
| Hitachi S8840 | |
| Hitachi FE-SEM model S-4160 | |
| Hitachi S-4500 | |
| Hitachi S-4700 | |
| Hitachi S-8820 | |
| Hitachi S-9300 | |
| Micrion FIB model M9500 | |
| LEO FE-SEM model 982 | |
Contact us by sales@ag-rtp.com now for more information.
Copyright 2007 AG-RTP· All rights reserved.
AG-RTP is DBA of Allwin21 Corp.
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