Reactor Center

* Dual quartz chambers for 100-150mm wafers( or 150-200mm wafers), cassette to casette operation
* Automatic pneumatic soft-lift assemblies for each chamber
* In-line gas filters (0.05 micron)
* Two PM 732 automatch networks
* Quartz halogen lamp for preheating
* Process capabilities: positive and negative resist, hardened resist, polyimide

Process control and instrumentation

* Microprocessor controller, menu driven
* 20 recipes maximum
* Programmable Process Parameters: Gas Flow, Chamber Pressure, RF Power, Strip time, Heat Lamp On time, overstrip time
* Programmable Tolerance Limits: RF Power (forward and reflected), Time, Pressure, Gas flow, Pumpdown
* Automatic pressure control
* CRT system status display
* Programmable tolerance limit alarm
* Sixty four key, alphanumeric keypad for entry of process and system parameters
* seventy two hour battery backed RAM for program memory

Gas Handling Module and Control Features

* Two process gas lines and one purge line to include: One O2 @ 4000 SCCM mass flow controller, Optional gas (blank), fast and slow N2 purge
* All Stainless steel valves and gas lines
* Automatic variable throttle valve for pressure control
* Separate capacitance manometers for each chamber with isolation valve

Wafer Handling and Sensing

* Automatic pick-and-place wafer handling
* Two elevator cassette stands for send-to-receive operation

Power Cabinet Assembly

* 510 Power Distribution Module
* Wafer Heating Module
* Separate control for system power, RF generator, and vacuum pumps control signal
* Shielded high-voltage components
* Emergency OFF switches
* Cover safety interlocks
* 12-VAC control to complete system
* ENI Mod.-12A RF Generator, 13.56MHz, crystal controlled, 0-1000 watts, continuously rated, Solid state, water-cooled

Safety and Security Features

* All covers interlocked
* Emergency OFF switches
* Electronic and software interlocks for RF power, wafer heating and gas flow