Rapid thermal processing (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. The wafers must be brought down (temperature) slow enough however, so they do not break due to thermal shock..Such rapid heating rates are attained by high intensity lamps process. These processes are used for a wide variety of applications in semiconductor manufacturing including dopant activation, thermal oxidation, metal reflow and chemical vapor deposition.

Rapid thermal anneal (RTA) is a process used in semiconductor device fabrication which consists of heating a single wafer at a time in order to affect its electrical properties. Unique heat treatments are designed for different effects. Wafers can be heated in order to activate dopants, change film-to-film or film-to-wafer substrate interfaces, densify deposited films, change states of grown films, repair damage from ion implantation, move dopants or drive dopants from one film into another or from a film into the wafer substrate. Rapid thermal anneals are performed by equipment that heats a single wafer at a time using lamp based heating that a wafer is brought near. Unlike furnace anneals they are short in duration, processing each wafer in several minutes. Rapid thermal anneal is a subset of processes called Rapid Thermal Process (RTP).

We can provide the following new and refurbished RTP equipment.

AccuThermo AW 410

AccuThermo AW 610

AccuThermo AW 810

AG Heatpulse 210

AG Heatpulse 410

AG Heatpulse 610

The main difference among the above manual desktop Rapid Thermal Processors is as following.

Model	New RTP Systems			Used RTP System
	AccuThermo AW 410	AccuThermo AW 610	AccuThermo AW 810	AG Heatpulse 210	AG Heatpulse 410	AG Heatpulse 610
Design Year	2007	2006	2008	1982	1984	1987
Control Technology	2000's(AW Advanced)	2000's(AW Advanced)	2000's(AW Advanced)	1980's(PID)	1980's(PID)	1990's(PID)
Electronic Components	Modern new components	Modern new components	Modern new components	old and aged components	old and aged components	old and aged components
Chamber	Aluminum Plates	Aluminum Plates	Aluminum Plates	Sheet Metal	Aluminum Plates	Aluminum Plates
Cold Wall	Cold Wall	Cold Wall	Cold Wall	Cold Wall	Cold Wall	Cold Wall
High Temperature Sensor	ERP Pyrometer	ERP Pyrometer	ERP Pyrometer	No	Single Pyrometer	Single Pyrometer
Pyrometer Calibration	Easy and precise	Easy and precise	Easy and precise	No	Difficult and not precise	Difficult and not precise
CE Certification	Yes	Yes	Yes	No	No	No
Temperature Range	100-800 C or 100-1250C	100-800 C or 100-1250C	100-800 C or 100-1250C	100-1000C	100-800 C or 100-1250C	100-800 C or 100-1250C
Temperature Precision	+/- 1 C	+/- 1 C	+/- 1 C	+/- 12 C	+/- 7 C	+/- 7C
Ramp Rate	10-200 C/S	10-200 C/S	10-200 C/S	10-150 C/S	10-200 C/S	10-200 C/S
Gases	1 to 4 with MFC	1 to 4 with MFC	1 to 4 with MFC	1 only with Flow Meter	1 only with Flow Meter	1 only with Flow Meter
Software	Advanced AW Software	Advanced AW Software	Advanced AW Software	AG Old Software 1982	AG Old Software 1984	AG Old Software 1987
Computer	Embedded control PC	Embedded control PC	Embedded control PC	286	386	486
Atmosphere	Yes	Yes	Yes	Yes	Yes	Yes
Wafer Size	2 to 4 inch	2 to 4 or 4 to 6 inch	4 to 6 inch or 5 to 8 inch	2 to 4 inch	2 to 4 inch	2 to 4 or 4 to 6 inch
Wafer Shape	Round or Square	Round or Square	Round or Square	Round or Square	Round or Square	Round or Square